Scanning Acoustic Microscopy
At CSAM Lab, we’ve dedicated our entire operation to perfecting Scanning Acoustic Microscopy (SAM) and our proprietary C-SAM™ imaging solutions—so you can zero in on internal delamination, voids, cracks, and package defects without ever compromising the integrity of your devices. By concentrating solely on acoustic-based inspection and failure analysis, we’re able to deliver high-resolution images that reveal subsurface anomalies invisible to conventional optical or X-ray methods, all while ensuring a non-destructive, contact-free process.
Unparalleled Image Resolution and Depth Penetration
Our state-of-the-art SAM and C-SAM platforms scan at frequencies up to 500 MHz, producing detailed tomographic slices through plastic-molded ICs, ceramic modules, and complex semiconductor assemblies. With vertical resolution down to a few microns and lateral resolution in the sub-micron range, you’ll see crisp, high-contrast delineation of bond-wire fences, micro-void clusters, and interfacial delamination—critical for identifying early signs of mechanical stress, moisture ingress, or thermal fatigue.
Tailored Workflows for Rapid Turnaround
Time-to-report is a critical metric in both high-volume manufacturing and root-cause failure investigations. At CSAM Lab, our processes are engineered around efficiency:
Automated Scan Recipes: Pre-validated protocols for common package types accelerate setup, while fully configurable parameters let you dive deeper where needed.
Batch Processing: Scan dozens of identical samples in a single run without operator intervention, dramatically reducing per-sample cycle time.
Streamlined Reporting: Clear, annotated imagery and data-packed analytics reports—complete with quantitative metrics on defect size, location, and severity—are delivered within 48 hours of sample receipt.
Industry-Leading Expertise, Focused on Acoustic Imaging
By eschewing one-size-fits-all failure labs in favor of a singular concentration on SAM and C-SAM, our team has amassed decades of collective experience. Every technician, engineer, and analyst at CSAM Lab is deeply versed in acoustic wave propagation, signal processing, and materials science, enabling us to:
Optimize coupling media for delicate substrates.
Tune transducer selection to balance penetration versus resolution.
Apply advanced signal-enhancement algorithms to boost image clarity in the most challenging geometries.
Wide-Ranging Applications Across Electronics Manufacturing and Beyond
From wafer-level reliability screening to post-mortem failure analysis, our acoustic imaging services support:
Quality Control: Detect process-induced voiding and early delamination before it leads to field failures.
Failure Investigations: Pinpoint the root cause of intermittent electrical shorts, package cracks, and solder-joint fatigue without sectioning or decapsulation.
R&D Characterization: Study laminar interfaces in novel packaging materials, under-fill behavior, and emerging 3D integration architectures.
Cost-Effective, High-Throughput Partner
Our single-technology focus allows us to optimize equipment utilization and maintain lean operations, translating into competitive pricing for high-resolution acoustic imaging. Whether you’re running a high-volume production line or investigating a single complex failure, CSAM Lab scales to meet your needs without sacrificing quality.
When it comes to nondestructive, high-fidelity internal imaging, CSAM Lab stands alone. By harnessing the power of Scanning Acoustic Microscopy and our proprietary C-SAM™ techniques, we deliver the clarity, speed, and expertise you need to keep your products performing flawlessly—inside and out. Partner with CSAM Lab today, and let us uncover what lies beneath the surface.
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